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Packaging Hot Melt Excelta™ LM 2

Paramelt

Metallocene performance at lower temperatures

Due to safety and economic reasons, the industry is increasingly driven towards lower application temperatures for hot melt bonding. In such a case the challenge is to maintain a credible working range for the bonded package.

With the low melt product Excelta LM 2, Paramelt has managed to achieve an efficient balance in performance, offering a service temperature range from -30°C to +45°C whilst still allowing for a reduction in hot melt application temperature as low as 100-120°C.

The product is successfully used in diverse sectors like the dairy, poultry and chocolate industry.

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