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Teledyne declares production readiness for wafer level packaged uncooled infrared detectors

Teledyne Technologies announced that its subsidiary, Teledyne DALSA, has completed the qualification of a wafer-level-packaged vanadium oxide (VOx) microbolometer process for long wave infrared (LWIR) imaging.

Microbolometers are Micro Electro Mechanical Systems or MEMS-based devices which detect infrared, or thermal, radiation and do not require cooling.

Teledyne DALSA’s manufacturing process, located in its captive MEMS foundry in Bromont, Quebec, integrates proprietary low cost Wafer Level Packaging technology that bonds two 200 mm wafers precisely and under high vacuum, forming an extremely compact 3D stack.

This technology eliminates the need for conventional chip packaging – which can account for 75% or more of the overall device cost.

Teledyne president and CEO Robert Mehrabian said: “This is an important milestone in our journey to bring a credible price/performance VOx solution to market.

 “With the qualification process complete we will now begin ramping up production lines for a 17-micron pixel 320×240 (QVGA) device, closely followed by a 17-micron 640×480 (VGA), with longer-term plans to introduce a highly compact 12-micron detector family.

“Among other applications, these new detectors will be offered as modules for OEMs and also integrated into Teledyne DALSA’s Calibir™ camera platform.”

Teledyne DALSA is an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-ray; our MEMS foundry has earned a world-leading reputation.