With new technologies coming onto the market that can sense and report on pack conditions, Pira is to stage an Impact forum on ‘Printable Sensors in Packaging and Label Applications’. The programme will include presentations from leading producers of sensors, academic researchers and end users with practical experience of using these technologies.
Topics will include: manufacturing techniques for sensors; combining sensors with wireless technology for remote pack condition monitoring; combining sensors with gas scavengers and other active packaging techniques; chemical and conductive ink developments and nanotechnology; cost implications and cost benefit analysis; the current regulatory scenario; and applications and case studies.
The event will be held in Pira’s Leatherhead, UK, premises next April – the actual date has not yet been fixed.
Tel: +44 (0) 1372 802000
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