Mycronic AB has introduced a range of new compact, high-capacity MY300 pick-and-place machines at SMT Hybrid Packaging in Nuremberg, Germany.
Claimed to be compact and having high capacity, the MY300 series have been designed to deliver a 40% smaller footprint than past models.
It is the second release in the next-generation MYPro series from the Swedish assembly machine manufacturer.
Mycronic will launch three different models of MY300 available as of now in MY300DX, the MY300SX and the MY300LX. The new pick-and-place machines are said to provide any intelligent factory with a broad range of highly automated line configurations.
MY300 is expected to boost productivity of SMT manufacturers in a wide range of complex applications. The new range, Mycronic says will address the challenges faced by SMT manufacturers from growing product mixes and factory space constraints along with a wider line of miniaturized components.
Mycronic SMT assembly solutions VP Robert Göthner said: “Demands are constantly on the rise for higher degrees of automation, more component varieties and increased overall productivity – particularly among high-mix manufacturers.
“The MY300, built on a new compact and user-friendly platform design meets all of these needs for manufacturers of electronics.”
According to Mycronic, due to automatic job selection, rolling changeovers, and quicker board transfer and tool changes, the MY300 range achieves higher speeds of operation.
Courtesy of simultaneous assembly of multiple boards, Mycronic claims that there is a significant increase in throughput in the new pick-and-place equipment.
Apart from that, the enhanced linescan vision system makes sure of a future-proof solution for highly advanced components.