Siemens business unit Mentor has introduced a new solution for the design and verification of the existing IC package designs.
The Mentor Xpedition High-Density Advanced Packaging (HDAP) flow solution can be used for rapid prototyping assembly, physical design, verification, signoff, and modeling.
It integrates the Mentor Xpedition, HyperLynx, and Calibre technologies.
Mentor said the worlds of IC design and packaging design are converging with emerging advanced packaging technologies such as fan-out wafer-level packaging (FOWLP).
The new HDAP flow features Xpedition Substrate Integrator tool, which is a graphical and rapid virtual prototyping environment that explores and integrates heterogeneous ICs with interposers, packages and PCBs.
With a rule-based methodology, the Xpedition tool will offer fast and predictable assembly prototyping of complete cross-domain substrate systems.
It also includes Xpedition Package Designer tool, which is a complete HDAP design-to-mask-ready GDS output solution that manages the physical implementation of the package.
The tool is said to leverage the built-in HyperLynx design rule checking (DRC) for detailed in-design checking before signoff, and the HyperLynx FAST3D package solver provides package model creation.
Xpedition HDAP flow is incorporated with HyperLynx technologies for 3D signal integrity (SI) and power integrity (PI), and in-process design rule checking (DRC).
The Calibre 3DSTACK technology offers 2.5D/3D package physical verification, when integrated with the Xpedition Package Designer tool.
In addition, the firm has launched outsourced assembly and test (OSAT) Alliance program, which features design flows, tool kits, and recommended best practices for verification and signoff processes to create HDAP projects
Mentor board systems division vice-president and general manager Incorvaia said: "The new Xpedition HDAP solution from Mentor brings together proven, industry-leading technologies from Xpediton, HyperLynx, and Calibre.
"Companies are looking for a proven focused solution for FOWLP that combines foundry and OSAT design and manufacturing signoff support. The Xpedition HDAP flow provides our customers with a unified design and verification environment for foundry sign-off-ready designs."