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Kulicke & Soffa to showcase packaging solutions at SEMICON China 2018

Kulicke & Soffa Industries will showcase its newly launched equipment and marketing leading packaging solutions during SEMICON China 2018 trade show in Shanghai, which will be held from 14 March to 16 March.

The latest range of solutions, RAPID Pro GEN-S (Smart) Series ball bonder and OptoLux ball bonder for LED will be featured at the SEMICON China trade show.

The RAPID Pro introduces advanced process capabilities with real-time monitoring and diagnostics to ensure highest yield, while the high speed OptoLux is set to revolutionize the wire bonding in LED market focusing on ease-of-use with recommended start-up parameters to facilitate process optimization.

 In addition to these, the Company will be demonstrating capabilities of its high performance APAMA DA die attach, latest multifunctional iFlex T2 equipment, together with its broad range of aftermarket products and services comprise of spares, consumables, software, repair and refurbishment services.

Kulicke & Soffa global sales and aftermarket products and services business unit senior vice president Hoang Huy Hoang said: “The semiconductor market continues to evolve rapidly with increasing demand of highly complex and more integrated packaging technologies.

“Apart from providing our customers with innovative and high-performance equipment to address these challenges, we want to extend our support through a full range of aftermarket solutions to improve uptime, enhance asset utilization and augment fleet and process management.”

As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades.

 In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings.