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Kulicke & Soffa to exhibit new solutions at SMT Hybrid Packaging 2017

Kulicke & Soffa Industries is set to showcase its new packaging solutions at the SMT Hybrid Packaging trade show in Germany.

The event will take place from 16 to 18 May in Nuremberg.

Kulicke & Soffa will showcase its products such as Asterion UW, which is a new ultrasonic welding solution that serves as an alternative in high power applications, as it holds higher current carrying potential than a wire bonded connection.

Hybrid Wafer Feeder allows to combine ultra-high-speed passive and active placement with high-accuracy flip-chip bonding directly from wafer, making it to be suitable for using in high-volume System-in-Package (SiP), flip-chip, die-attach and wafer-level-package manufacturing.

With placement accuracy of up to 7µm at 3 sigma, the Hybrid Wafer Feeder is said to serve as a better alternative to existing commercial solutions.

The company will also exhibit other solutions, including the IConn ProCu PLUS high-performance wire bonder, Asterion extended version (EV) wedge bonder, iFlex H1 multifunction equipment Quantis QFN capillary, in addition to FCC Plus and Opto Plus dicing blades at the event.

Kulicke & Soffa AP-hybrid, electronics assembly, wedge bonders, capillaries and blades business lines senior vice president Chan Pin Chong said: “The new Asterion UW and Horizontal Wafer Feeder on the Hybrid provides a compelling set of high-reliability solutions serving the automotive, semiconductor and industrial markets.”

Kulicke & Soffa offers semiconductor packaging and electronic assembly solutions for the automotive, consumer, communications, computing and industrial segments.

With strategic acquisitions in recent years, the company has added a range of advanced packaging, electronics assembly, wedge bonding and other expendable tools to its portfolio.

Image: Kulicke & Soffa to exhibit new packaging solutions at SMT Hybrid Packaging trade show. Photo: courtesy of aopsan /