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KraussMaffei Berstorff to exhibit technological solution concepts at Equiplast event

Extrusion technology provider KraussMaffei Berstorff said it will showcase its new technological solution concepts at Equiplast event in Spain, which is due to be held from October 2 to 6, 2017.

At the event, the company will present the PO 5-layer pipehead KM-5L RKW 01-40 at booth D 458, hall 3.

The modular design of the pipehead KM-5L RKW 01-40, featuring axial, radial, and conical spirals, will make sure maximum precision and exact layer thickness distribution at high line speeds.

It also offers better flexibility in the processing of various PO materials like PE-RT, PE-X, or PB.

KraussMaffei Berstorff Munich general sales manager Andreas Kessler said: "In recent years the design of our spiral distributor system has been perfected; with our clever pipehead concept we have reached a leading market position. The massive sales success within a very short period of time is our proof.

"We are also launching our flexible and modular concept on the Iberian market and meet the high market requirements for excellent end product quality and competitive production.”

The 5-layer pipes are designed with various features such as stress cracks resistance, scratch resistance, oxygen tightness, diffusion, temperature resistance and insulation properties to provide long service life.

Kessler added: "In the southern European market processors are currently focusing on pipes for non-pressure applications, such as drainage or sewer pipes. For this application we offer producers feasible, customer-specific, and interesting solution concepts.

“With our systems the processor achieves a premium quality end product with maximum material cost savings. We also offer our direct extrusion concept for the production of high-filled, multilayer sewer pipes made from polypropylene for the southern European market.”


Image: KraussMaffei Berstorff to exhibit technological solution concepts at Equiplast in Spain. Photo: Courtesy of KraussMaffei Berstorff.