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High-Barrier Technology Forum at the Fraunhofer IVV

High-Barrier Technology Forum at the Fraunhofer IVV

24 April 2015

High-Barrier Technology Forum at the Fraunhofer IVV

On 16 and 17 June 2015 the Fraunhofer Institute for Process Engineering and Packaging IVV is hosting an international technology forum in Freising. This event is being organized jointly with the Fraunhofer Institute for Silicate Research ISC.

High-Barrier Technology Forum –

  • Cost-efficient and compatible
  • New aspects of industrial manufacturing and applications.
  • Novel material concepts, processes, and tools.

The event, which will be held in English, will bring together developers and users of high-barrier films to exchange views, ideas, and results at an international level.

The Fraunhofer IVV und ISC play key roles in the development of high-barrier technologies. They are vital partners for the processing and packaging industries, developing innovative high-barrier films for future mass applications. The Technology Forum will start with a brief introduction of barrier principles and relevant test methods. Thereafter there will be talks on new trends and developments from industry and R&D, followed by open debate. The High-Barrier Technology Forum will also offer a creative element – a World Café – for information exchange amongst experts and network promotion.

The full event program can be found at

Your contact person at the Fraunhofer IVV is Petra Gabler:
Phone +49 8161 491-124,