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CSP to address headspace challenges in pharmaceutical products

CSP Technologies plans to showcase its solutions for improving shelf life for transdermal and oral solid dose drugs at the upcoming Smart Packaging Conference in Germany.

As part of it, the US-based manufacturer will demonstrate the benefits of its Activ-Polymer technology and also its Activ-Film materials for headspace management.

The American firm will bring to table its patented solution to handle headspace challenges like moisture and oxygen ingress whose negative impacts it says can be dangerous to the efficacy of pharmaceutical products.

CSP Technologies stated: “Despite being two very different drug delivery platforms, oral solid doses and transdermal patches can face similar packaging headspace challenges that impact shelf life; besides moisture and oxygen ingress, exposure to certain conditions can lead to the formation of volatile organic compounds (VOCs) and other gases that, in turn, may interact with drug products and capsules, adversely impacting their stability.”

CSP claims that its technology when used within pouch, blister and other small spaces can turn out to be an effective and efficient management solution.

Without using adhesives or purging, canisters or loose sachets, the technology from CSP can address a broad range of desiccant and scavenging requirements.

CSP Technologies says that its Activ-Film technology can help in keeping a check on residual humidity or oxygen levels. It can also remove odors and decrease the levels of certain volatile organic compounds (VOCs) in a package.

On the other hand, the Activ-Blister solutions can regulate the internal atmosphere of existing individual blister cavities thereby resulting in better product performance and improved shelf life.