Brewer Science is inviting people to join the company on 21 April for the Advanced Packaging & System Integration Technology Symposium in Wuxi, China.
Organized by Yole Développement and the National Center for Advanced Packaging (NCAP China), this event will focus on the field of advanced packaging and include the newest developments in fan-out packaging, system in package, advanced substrates, 3D technology & embedded technologies, as well as MEMS & sensors packaging, radio frequency, and photonics.
Dr. Tony D. Flaim, Chief Technical Officer for Brewer Science, will be the keynote speaker on Friday, April 21, at the Advanced Packaging & System Integration Technology Symposium.
Dr. Flaim will speak from 9:00 am to 9:45 am on, "The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates."
Attendees are invited to reserve the date and make plans to hear Dr. Flaim's presentation as he discusses the issues, challenges, and opportunities in the industry.