Compelo Packaging - Latest industry news and analysis is using cookies

ContinueLearn More

Thin Film and Bemis partner to develop intelligent packaging platform

Norway-based developer of printed electronics, Thin Film and Bemis have signed an agreement to develop a flexible sensing platform for the packaging market.

According to Thin Film, the new category of packaging can collect and communicate sensor information wirelessly, worldwide for use by food, consumer products and healthcare companies.

Thin Film will create a customizable sensor platform, as part of the agreement with Bemis, which will subsequently tailor to its customers’ individual requirements.

The Intelligent Packaging Platform, which is expected to be commercially available in 2014, can be adapted to monitor and record key physical properties and environmental data in packaged perishable products.

Bemis president and chief executive officer Henry Theisen said intelligent packaging is an emerging technology with potential intersections with Bemis’ flexible packaging and pressure sensitive materials business segments.

"Our agreement with Thinfilm represents an investment in a technology that could eventually make printed electronics a component of every package we manufacture," Theisen added.