Independent package design and assembly company Sencio launched nCapsulate freeform packaging technology, which adds an extra dimension to sensor and MEMS encapsulation.
As nCapsulate offers freedom of shape when encapsulating semiconductor sensors or MEMS, it allows manufacturers to add functional features that streamline assembly or to integrate the device encapsulation directly into system housing components, leading to quicker, cost-effective system assembly.
nCapsulate is said deploy transfer molding with a thermosetting compound that provides better isotropy and thermomechanical stability than the thermoplastics of standard injection molding technologies.
These are combines with special mold tools developed by Sencio and a toolshop partner.
Sencio technology, research & innovation manager Jurgen Raben said the company’s goal was to develop new encapsulation solutions that provide customers added value.
"nCapsulate does exactly that. Its freeform nature helps manufacturers streamline or even eliminate post-encapsulation assembly steps to improve production efficiency and save money.
Moreover, customers can combine nCapsulate with our other functional packaging capabilities, such as the ability to expose sensor surfaces while protecting delicate integrated circuits, to create a functional packaging solution tailored to their precise needs."
nCapsulate can also be applied to leadframe based packaging and other substrates such as PCBs or ceramics, said the company.