Global adhesives manufacturer Henkel has introduced a new hotmelt adhesive, the Technomelt Supra 100 Cool with an application temperature of 100°C, for the food packaging industry.
The new adhesive combines the benefits of the Supra product range and is claimed to promote sustainability in customer operations.
Technomelt Supra 100 Cool is also characterized by its suitability in case sealing, carton closing and tray erection, and its low application temperature reduces the energy requirement by up to 50%.
The adhesive provides good heat resistance and cold flexibility and is suitable for both warm-filling and deep-freeze applications. It reduces adhesive consumption in the case of a carton sealing by up to 25%.
Henkel combines innovation with sustainability with the new generation of low-temperature packaging adhesives, and further underlines its proposal to progress in support of the packaging sector and the consumer goods industry.