Compelo Packaging - Latest industry news and analysis is using cookies

ContinueLearn More
Close
Dismiss

Dow to exhibit new packaging solutions at PACK EXPO 2012

US-based Dow Chemical Company, a performance packaging business, will display its portfolio of new packaging solutions at PACK EXPO International 2012 on 28-31 October in Chicago, Illinois.

At PACK EXPO, it will introduce a new laminating adhesive, ADCOTE Adhesives and Coatings, a new series of AGILITY Processing Accelerators and two additions to its existing DOWLEX Linear Low Density Polyethylene (LLDPE) resins portfolio.

Dow North American performance packaging director Dave Kyle said it continues to work hard to be an innovator of packaging solutions, delivering value to its customers and enabling better packaging for society.

"At this year’s PACK EXPO, Dow will illustrate how its portfolio of industry-leading products and technologies – resins, films and adhesives – can be tailored to meet virtually every packaging need," Kyle said.

It will also host a variety of informational forums entitled Networks with Answers, highlighting Dow’s technical knowledge, packaging solutions, product applications and collaborative relationships across the value chain.