Creative Edge Software, developer of the award-winning iC3D packaging design software, announces its attendance at the Eastern Winery Expo.
The event takes place March 22nd – 24th at the Oncenter in Syracuse, NY and iC3D will be exhibiting at booth 1215. This will be the first showing in the Americas of the latest iC3D release including new feature Bump Displacement, which enables designers to create unique 3D shapes and surfaces for premium and luxury packaging effects.
With the latest release of iC3D enhancements, Bump Displacement packaging creatives are able to quickly create and visualize emboss or deboss design features to a photorealistic standard in a matter of minutes. This development is of particular relevance to the luxury packaging industry, including wine and spirits, where unique and complex shapes in glass, plastic and other materials are used to distinguish premium products.
According to Marshall Hogenson, Director of Sales in the US and Canada, a key benefit of the iC3D Bump Displacement feature is its simplicity and speed. “Designers and creatives are able to visualize their ideas and truly experience their designs, allowing brand owners to increase the effectiveness and impact of their packaging before ever going to print. This, in turn, cuts down on time-to-market and lowers production costs,” he explains.
“We are excited to be participating in the Eastern Winery Expo. It truly is a one-of-a-kind event crafted to not only bring the industry together, but also to deliver a more personalized and relevant conference experience – one that elevates the collaborative design process and emphasizes its strategic business value.”