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Comexi to unveil new packaging technologies at K Fair in Germany

Converting solutions supplier Comexi Group will exhibit its latest packaging innovations at the K Fair to be held from 16 to 23 October 2013 in Germany.

At the fair, the company will present Solventless platform concept through which it produces solventless products such as inks, adhesives or laminates, among others.

Comexi will also present the benefits of the new water-based printing system COMEXI FLEXO F2 that has a high flow drying system dedicated to the drying of white as a first color background with dehumidified air.

During the event, the company will also introduce its new COMEXI OFFSET CI8 printing system, which is capable of adapting the central impression offset technology to the flexible materials while reducing costs.

The company will also exhibit its gravure printing press COMEXI ACOM R2 that incorporates all its latest technologies, such as machinery control, direct drive systems or the flexibility of the printing process through the control.