Various customised packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types. The newest technology development enables the production of SDBGAs (stacked die ball grid arrays) using transfer molding technology in small and medium-sized volumes.
- Base materials: LTCC, Al2O3, PCB
- I/O configurations: ball grid array (BGA), land grid array (LGA), castellation, single in-line / dual in-line (SIL/DIL), quad flat packages (QFP)
- Housings: non-hermetic housings using plastic/metal covers or organic coatings, hermetic housings by soldering
- Ball grid array packages: stacked die BGA (SDBGA), BGA, high-voltage BGA