High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturisation, high performance, high frequencies and reliability play a role.
- Highly complex HDI/microvia substrates in flex, rigid-flex and rigid technology
- High-frequency and high-temperature applications
- Microfluidic substrates
- Comprehensive range of base materials, constraining materials and surface finishes
- Enhanced features such as embedded passives, wrap-around, cavities
- Chip-on-flex (COF) and chip scale packaging (CSP) substrates
- LCP (liquid crystal polymer) substrates