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PCBs and Chip-Packaging Substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturisation, high performance, high frequencies and reliability play a role.

  • Highly complex HDI/microvia substrates in flex, rigid-flex and rigid technology
  • High-frequency and high-temperature applications
  • Microfluidic substrates
  • Comprehensive range of base materials, constraining materials and surface finishes
  • Enhanced features such as embedded passives, wrap-around, cavities
  • Chip-on-flex (COF) and chip scale packaging (CSP) substrates
  • LCP (liquid crystal polymer) substrates


Quick Contact PCBs and Chip-Packaging Substrates