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Advanced Assembly

State-of-the-art manufacturing equipment and inspection technologies, in the field of SMT (Surface Mount Technology) and chip & wire, enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturised electronic modules.

  • Automated SMD assembly on any board material
  • Flip chip / CSP (chip scale package) capability
  • Die attach technologies
  • Wire bonding technologies
  • Die protection and encapsulation

assembly

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