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Microsemi develops new die packaging technology

Microsemi has developed a new die packaging technology to reduce the size of radio modules employed in implantable medical devices such as pacemakers and cardiac defibrillators by 75%.

In addition to implantable medical devices, the die packaging technology can be used in hearing aids, intelligent patches, nerve stimulators and drug delivery products consisting thermal and mechanical stressing to MIL-STD-883 test standards.

Microsemi advanced packaging business and technology development manager Martin McHugh said the internal die packaging technology qualification provides a solution to drive the development of miniaturized wireless medical products.

"Our advanced packaging technology can also be paired with our industry-leading, ultra low-power ZL70102 radio to enable wireless healthcare monitoring," McHugh added.

"Moving forward, we plan to apply our size-reduction techniques and radio technologies to other markets such as smart sensing and applications where size and weight are critical success factors."