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Master Bond - Adhesives, Sealants, Coatings and Potting/Encapsulation Compounds

Adhesives, Sealants, Coatings and Potting/Encapsulation Compounds

Silver Conductive Epoxy Meets NASA Low Outgassing Standards

The adhesive cures at room temperature in 24hrs – 48hrs and in just 1hrs – 2hrs at 200ºF, producing tough high strength bonds. It features a tensile shear strength of more than 1,800 psi, a T-peel of greater than 5pli, and outstanding adhesion to similar and dissimilar substrates. The volume resistivity of the system is less than 10-3 ohm-cm. Serviceable over the exceptionally wide range of 4K to 275ºF, EP21TDCS-LO is suitable for cryogenic applications. It withstands thermal cycling and is resistant to chemicals, including water, oil and most organic solvents.

The epoxy offers a simple one to one mixing ratio by weight or volume. With its low drip formula, EP21TDCS-LO can be conveniently applied with a syringe, knife, spatula or trowel to vertical surfaces without sagging and only contact pressure is required for curing. Syringes have a three month shelf life and glass jars have a six month shelf life, if stored at room temperature. EP21TDCS-LO is available in premixed and frozen syringes, as well as in metal containers.

Master Bond electrically conductive adhesives

Master Bond’s Polymer System EP21TDCS-LO was developed for high performance bonding and sealing where superior electrical conductivity and NASA low outgassing certification is required. Read more about Master Bond’s electrically conductive adhesives here or contact technical support by phone on +1-201-343-8983, by fax on +1-201-343-2132 or by e-mail at techinfo@masterbond.com.