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Master Bond - Adhesives, Sealants, Coatings and Potting/Encapsulation Compounds

Adhesives, Sealants, Coatings and Potting/Encapsulation Compounds

High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature

Supreme 33 has a mix ratio of 100 to 70 by weight or one to one by volume. It cures conveniently at room temperature in 48hrs to 72hrs. For optimal performance, the suggested schedule is curing overnight at room temperature followed by two to three hours at 150°F to 200°F. This 100% reactive epoxy does not contain any solvents or diluents, has exceptional dimensional stability and features very low shrinkage upon cure.   Supreme 33

It produces high performance bonds boasting a shear strength over 2,500 psi, a tensile shear strength greater than 7,500 psi and a T-peel strength exceeding 15pli. With a volume resistivity of 1014ohm-cm, a dielectric strength over 400volts/mil, and a dielectric constant of 3.8 at 75°F, Supreme 33 is an outstanding electrical insulator that is widely used in the electronic, electrical, aerospace and OEM industries. Supreme 33 is also available in a non-drip version called Supreme 33ND.