Embedded-resistor copper foil technology is applied mainly when form-factor reduction is required or if the available space for active components has to be optimised. Furthermore, designs benefit from improved signal routing through the elimination of vias and shorter signal paths.
DYCONEX has applied this technology to a three-layer HDI rigid-flex build-up in the PCB for an innovative specific absorption rate sensor. By doing so, the company has proven its high-yield production and test capabilities for the new material.
Today, DYCONEX offers a complete solution from product design support through to testing.