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DYCONEX Qualifies New Multibond Process for High-Reliability PCBs

Multibond is applied to high-reliability multilayer PCBs to improve the bonding between the single layers of a board. The underlying principle is a micro-roughening process in combination with an organic copper conversion coating for PCB inner layers. The new treatment leads to an improved adhesion between them and the prepregs, thus enhancing the peel strengths of the whole circuit board.

Furthermore, Multibond is also applied to roughen copper layers in order to improve CO2 laser drill energy absorption. This leads to better via quality and enhanced throughput.

To gain a deeper understanding of how Multibond can improve your PCB performance, please contact us at: mail.dyconex@mst.com.

Multibond application